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Fire Sci. Eng. > Volume 32(6); 2018 > Article
Fire Science and Engineering 2018;32(6):108-116.
DOI: https://doi.org/10.7731/KIFSE.2018.32.6.108    Published online December 31, 2018.
구리 용융흔 미세조직 관측을 위한 연마/미세연마 프로세스 개발
박진영, 방선배
1한국전기안전공사 전기안전연구원
2한국전기안전공사 전기안전연구원
Development of Grinding/Polishing Process for Microstructure Observation of Copper melted Beads
Park Jin-Young, Bang Sun-Bae
1Korea Safety Research Institute
2Korea Safety Research Institute
요약
구리 용융흔(Melted bead) 미세조직(Microstructure)은 변형층(Deformed layer)과 원조직(Undeformed layer)으로 구분할 수 있다. 변형층이 존재하는 경우에는 측정오류가 발생되어 연마/미세연마(Grinding/Polishing)를 통하여 변형층을 제거하고 원조직을 관측하여야 한다. 이에 따라 본 연구에서는 구리 용융흔의 미세조직 분석을 위한 연마/미세연마 절차(Process)를 제시하였다. 변형층 제거를 위해 연마재 종류/크기, 연마시간, 연마율의 상관성을 분석하였고 변형층의 두께를 $1{mu}m$ 이하가 되도록 하였다. 연구결과, 실리콘카바이드 연마재 $15{mu}m$ (SiC P1200) 2 min, $10{mu}m$ (SiC P2400) 1 min, 다이아몬드 연마재 $6{mu}m$ 8 min, $3{mu}m$ 6 min, $1{mu}m$ 10 min, $.25{mu}m$ 8 min 실시하는 새로운 연마/미세연마 절차를 제시하였다. 또한 최종 단계에서 3 min 동안 콜로이달 실리카 $.04{mu}m$로 화학적 미세연마를 실시함으로써 미세조직의 선명성을 증대시키는 방안도 제시하였다. 연마/미세연마 시간은 총 38 min이 소요되며, 기존에 제시된 시간, 절차보다 단순화 하였다.
Abstract
A melted bead microstructure can be divided into a deformed and undeformed layer. Measurement errors occur in the presence of a deformed layer, which should be removed through grinding/polishing whilst preserving the original structure. This paper proposes a grinding/polishing process to analyze the microstructure of copper melted beads. For the removal of the deformed layer, the correlation between the abrasive type/size, the polishing time and polishing rate was analyzed and the thickness of the deformed layer was less than $1{mu}m$. The results suggest a new grinding/polishing procedure: silicon carbide abrasive $15{mu}m$ (SiC P1200) 2 min, and $10{mu}m$ (SiC P2400) 1 min; and diamond abrasive $6{mu}m$ 8 min, $3{mu}m$ 6 min, $1{mu}m$ 10 min, and $0.25{mu}m$ 8 min. In addition, a method of increasing the sharpness of the microstructure by chemical polishing with $0.04{mu}m$ colloidal silica for 3 min at the final stage is also proposed. The overall grinding/polishing time is 38 min, which is shorter than that of the conventional procedure.
Key Words: Copper beads, Deformed layer, Removal rate, Damaged layer, Polishing, Grinding
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