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Journal of Korean Institute of Fire Science and Engineering 1996;10(3):3-9.
Published online September 30, 1996.
진공증착중합법에 의해 제조된 PMDA /4,4′-DDE 폴리이미드의 내열 특성
김형권이은학우호환김종석이덕출
1인하대학교 전기공학과2한라공업전문대학 전기과3인하공업전문대학 전기과4대전산업대학 전기공학과5인하대학교 전기공학과
Heat resistant characterization of PMDA /4,4′-DBE polyimide of fabricated by vapor deposition polymerization
요약
PMDA와 4,4'-DDE 단량체를 이용하여 진공증착중합법으로 기판온도를 변화시키면서 제조한 폴리이미드 박막을 TGA(Thermogravimetry Analyzer)로 내열특성을 조사하였다. 박막 제조시 기판온도의 증가에 따라 증착율이 감소함을 알 수 있었으며, 기판온도가 7$0^{circ}C$ 이상 일때는 중합이 이루어지지 않아 폴리이미드라고 할 수 없었다. TG곡선으로부터 구한 5%중량 감소온도($T_{TG}$)는 기판온도가 $20^{circ}$, $40^{circ}$, $70^{circ}$일때는 $565^{circ}$, $397^{circ}$, $210^{circ}$이었다. 따라서 $20^{circ}$$40^{circ}$에서 제조한 박막이 20,000시간 동안 견딜 수 있는 온도는 각각 $230^{circ}$$200^{circ}$임을 예측할 수 있었다.
Abstract
The Polyimide thin films based on PMDA and 4,$4^{circ}$'-DDE were fabricated by VDPM, and their heat resistance characteristics were invastigated by TGA(Thermogravimetry Analyzer). It was found that deposition rate decreased with increasing substrate temperature and the thin films were not fabricated over the substrate temperature of $70^{circ}$. $T_{TG}$ of weight loss temperature is $565^{circ}$, $397^{circ}$ and $210^{circ}$ at the substrate temperature of $20^{circ}$, $40^{circ}$ and $70^{circ}$, respectively. It is realized that the endurace temperature for 20,000 hour of thin films fabricated at $20^{circ}$ and $40^{circ}$ is $230^{circ}$ and $200^{circ}$, respectively.
Key Words: Polyimide thin film, Thermogravimetry Analyser, 5% weight loss temperature
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